50% of fees
Fee waiver/discount
Expected August 2027
Lisans, Yüksek Lisans
Bond University
Belirtilmedi
Provides 50% tuition remission for any undergraduate degree including approved combined programs up to 320 credit points (excluding the Bond Medical Program), or postgraduate degree (excluding research degrees).
All International
Tüm cinsiyetler için geçerlidir
Her tür
Uygun öğrencilerin tümü
Tam zamanlı
All intakes
Mature students
To be eligible to apply for this scholarship, you must:
What are the obligations of this scholarship?
Bu burs için ayrıca başvuru yapmanız gerekiyor
If you meet the eligibility criteria for this scholarship, we encourage you to apply by following the below steps:
You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered
Expected August 2027