Amerika'da Syracuse University Üniversitesinde Bachelor of Science in Biomedical Engineering/Master of Business Administration Eğitimi Alın

Bölüm hakkında

Bölüm hakkında
- Genel Bakış
- Bölüm
Öğrenim seçenekleri
Giriş koşulları
- Uluslararası

Ne öğreneceğim?

The H. John Riley Dual Engineering/MBA Program is a leadership development program that gives Syracuse University students the opportunity to earn a bachelor’s degree from the College of Engineering and Computer Science and an MBA degree from the Martin J. Whitman School of Management. Graduates of this five-year program enter the workforce with a unique combination of skills-the engineering expertise needed to develop technological innovations and the business knowledge necessary to put these ideas into action.

Hangi bölümdeyim?

The College of Engineering and Computer Science

Öğrenim seçenekleri

Full Time (10 sömestr)

Okul ücreti

US$66,580.00 (TRY 2,287,815) Yıllık

Housing and food - $19,756

Başlangıç tarihi

Ağustos 2027

Yer

Syracuse Campus

900 South Crouse Ave.,

Syracuse,

New York,

13244, Northeast, United States

Full Time (10 sömestr)

Okul ücreti

US$66,580.00 (TRY 2,287,815) Yıllık

Housing and food - $19,756

Başvuru Tarihi

15/11/2026

Başlangıç tarihi

Ocak 2027

Yer

Syracuse Campus

900 South Crouse Ave.,

Syracuse,

New York,

13244, Northeast, United States

Giriş koşulları

Uluslararası öğrenciler için

You must be enrolled in or have graduated from an accredited secondary school. SAT/ACT scores will not be required for students applying for Spring 2026, Fall 2026, or Spring 2027 admission. Students who choose not to submit test scores will not be disadvantaged and will remain eligible for merit scholarships. Recommended high school coursework: Four years of college preparatory mathematics (including precalculus and/or calculus) Laboratory science (physics is strongly recommended but not required) Please submit at least one academic recommendation from a STEM teacher

Seçtiğiniz bölüme bağlı olarak farklı IELTS koşulları olabilir.